Performance of water and diluted ethylene glycol as coolants for electronic cooling

As the number of transistors increases with new generation of microprocessor chips, the power draw and heat load to dissipate during operation increases. As a result of increasing the heat loads and heat fluxes the Conventional cooling technologies such as fan, heat sinks are unable to absorb and heat transfer excess heat dissipated by these new microprocessor. So, new technologies are needed to improve the heat removal capacity. In the present work single phase liquid cooling system with mini channel is analyzed and experimentally investigated. Mini channels are chosen as to provide higher heat transfer co-efficient than conventional channel. Copper pipes of 0.36 mm diameter are taken to fabricate heat sink and heat exchanger. A pump is used to circulate the fluid through heat sink and heat exchanger. A solid heated aluminium block to simulate heat generated electronic component is used and electrical input is supplied to the heated aluminium block and cooling system is placed over the heated block. The performance of the cooling system is analyzed from the experimental data obtained. It is experimentally observed that the mini channel liquid cooling system with water as a coolant has better performance than diluted ethylene glycol as coolant at different flow rates. The surface temperature of the heated aluminium block with convective heat transfer co-efficient is observed